Equipment：
DEK Horizon 03iX with integrated 3D Solder Paste Inspection (SPI)

Accuracy：
±2μm solder paste thickness control

Yield：
1% paste volume deviation rate

High-Speed：
Siemens X4i (160,000 CPH) + Fuji NXT III modular platform

Capability：
01005 components to 60×60mm irregular parts

Repeatability：
±25μm placement accuracy

System:
BTU Pyramax 10-zone reflow oven with nitrogen atmosphere

Thermal Control:
±1°C peak temperature accuracy

Quality：
<0.02% cold joint rate

3D AOI：
MYCRONIC AOI Pro with 3D solder joint volumetry

X-Ray：
Nordson DAGE XD7600 for BGA void analysis

Defect Detection
>99.9% fault recognition rate